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| Source: | Find a Tender Service (FTS) |
| Notice Type: | Tender update |
| Buyer: | Semiconductor Catapult |
| Main Category: | Goods |
| Procurement Method: | Below threshold - open competition |
| Tender Status: |
| Open |
| Estimated Value (ex. VAT): | £100,000 |
| Estimated Value (inc. VAT): | £120,000 |
| Release Date: | 10 November 2026 |
| Application Deadline: | 2 December 2026 |
| Enquiry Deadline: | 23 November 2026 |
| Procurement ID (OCID): | ocds-h6vhtk-07b8cc |
| Notice Reference: | 106792-2026 |
All 2 notices for this procurement, oldest first.
CSAC2334 Thermal Interface Material (TiM) reliability tester
CSAC2334 Thermal Interface Material (TiM) reliability tester
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Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.
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Application Deadline
2 December 2026
22 days left
Estimated Value
£100,000
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