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| Source: | Find a Tender Service (FTS) |
| Notice Type: | Award notice |
| Buyer: | NPL Management Limited |
| Main Category: | — |
| Procurement Method: | Below threshold - unknown |
| Tender Status: | Closed |
| Estimated Value (ex. VAT): | Not specified |
| Release Date: | 14 October 2026 |
| Application Deadline: | — |
| Procurement ID (OCID): | ocds-h6vhtk-0787fc |
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Awarded to
| Award status: | Active |
Supply of an iBond 5000 manual ultrasonic wedge bonder for microelectronics and semiconductor packaging applications, including an Olympus stereo zoom microscope, deep-access wire and ribbon bonding clamp assemblies, heated workholder, ribbon spool holder, and related accessories. The contract also includes installation, commissioning, and operational training for users at NPL.
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| 097209-2026 |