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| Source: | Find a Tender Service (FTS) |
| Notice Type: | Award notice |
| Buyer: | UK Research & Innovation (UKRI) |
| Main Category: | Goods |
| Procurement Method: | Below threshold - without competition |
| Tender Status: | Closed |
| Estimated Value (ex. VAT): | Not specified |
| Release Date: | 9 January 2026 |
| Application Deadline: | — |
| Procurement ID (OCID): | ocds-h6vhtk-0602f8 |
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Awarded to
| Award status: | Active |
This purchase covers the design and fabrication of p-type silicon sensors for use with a number of different X-ray imaging camera systems currently in development at STFC. The silicon wafers consist of devices compatible with the XIDYN ASIC as well as other ASICs like HEXITEC and LPD. The sensors will be used to characterise the performance of these new camera systems to verify that the ASICs are meeting their specifications.
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| 001913-2026 |