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| Source: | Contracts Finder |
| Notice Type: | Award notice |
| Buyer: | UK Research & Innovation |
| Main Category: | Goods |
| Procurement Method: | Other - |
| Tender Status: | Closed |
| Estimated Value (ex. VAT): | £250,000 |
| Release Date: | 15 February 2024 |
| Application Deadline: | 13 February 2024 |
| Contract Start Date: | 15 February 2024 |
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Awarded to
| Award value: | £250,000 |
| Award decision date: | 13 February 2024 |
| Award status: | Active |
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Published contracts in the last 12 months
41
total contracts
£10.4m
total value
£651,509
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Typical categories
Pipeline status
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Application Deadline
13 February 2024
Closed
Estimated Value
£250,000
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Book a free consultation →| Contract End Date: |
| 30 July 2024 |
| Contract Duration: | 6 months |
| Procurement ID (OCID): | ocds-b5fd17-8d171fb7-eeb5-4d8f-a8d7-39f637926ff7 |
| Notice Reference: | ff94b41f-0998-4aa9-88d6-98f74526d0de-723867 |