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| Source: | Find a Tender Service (FTS) |
| Notice Type: | Tender notice |
| Buyer: | University of Strathclyde |
| Main Category: | Goods |
| Procurement Method: | Open procedure |
| Tender Status: | Complete |
| Estimated Value (ex. VAT): | £900,000 |
| Release Date: | 17 December 2025 |
| Application Deadline: | 26 January 2026 |
| Procurement ID (OCID): | ocds-h6vhtk-05f82e |
| Notice Reference: | 083991-2025 |
View Original Notice
Access the full notice on the official portal
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
Document pack· 1 file
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Pipeline status
Not addedContract imported automatically · AI writes the response
Application Deadline
26 January 2026
Closed
Estimated Value
£900,000
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