UK Public Sector Contracts & Tenders

Scope The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a ceramic 3D printer and post processing ovens to fabricate ceramic materials, capable of producing items suited to high temperature use. The printer shall allow CSA Catapult to create ceramic prototypes of arbitrary size and shape, ranging from 1 - 100 mm in length, particularly 40 x 70 x 100 as a minimum acceptable build volume. We are also interested in multi material capability allowing a minimum of two materials to be printed and form a solid (green / uncured) model. The parts created will be used functionally, so repeatability, dimensional consistency and process reliability are paramount. The estimated value of the contract is £500,000 to £650,000 including all options and extensions. The system will be installed at the CSA Catapult Innovation Centre in 2021. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-045 in the subject field.

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds as the system is not for mass production. As a part of the package assembly research and development methodology, we require a lapping and polishing machine to handle a wide range of metals and ceramics (copper, aluminium, titanium, beryllium, molybdenum, alumina, zirconium oxide and fused silica, silicon carbide and silicon nitride) for packaging purposes. This equipment shall be capable of lapping and polishing a wide range of 3D printed metal and ceramics from 25 um up to 50 nm and also from 25 um down to 50 um. The Machine or combination of machines shall be capable of polishing 2D and 3D parts. The size of the parts to be processed ranges from 130 x 130 x130 to 250 x 250 x 250 mm and suppliers can submit separate quotes for various systems with different lapping plate dimension ranging from 15" to 28". Detail of a machine or combination of machines for polishing 3D surface i.e., non-flat surfaces and consumables is required as part of the tender. The system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty, and service/maintenance support. System Outline The system is expected to be robust to handle the material listed above with a means of extracting dust and waste fluid from the enclosed space. The speed of the machine required for the 2D parts polishing must be adjustable with automatic plate flatness control and composed of automatic slurry dispense. The machine should be fully programmable requiring little skill to operate. A system solution is required that is flexible and upgradable in the future. The system should also include user software, installation and training. The machine or combination of machines shall be able to achieve lapping and polishing to the required level. The machine shall be fully programmable with an enclosed workspace with adjustable pneumatic pressure on the part. The supplier shall provide detailed information on the processes involved and consumables required for the lapping and polishing process including ultrasonic cleaning. Also, a list of any metrology tools required for the processes is needed. Additional information: The estimated value of the contract is £80,000 to £120,000 including good to meet the requirements, installation, training, options and extensions. The system will must be invoiced and delivered before the end of September 2021. To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-048 in the subject field.

Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive manufacturing technology. This will allow the CSA Catapult to support the Driving the Electric Revolution - Industrialisation Centres (DERIC) programme that is currently active within the UK in developing novel technology for power electronic devices and other types of semiconductor devices. The intention is that the additive manufacturing of bespoke metal components will closely support the requirements of development programmes and further the development of electronic and semiconductor device packaging with novel solutions not currently possible using traditional manufacturing techniques. The equipment will also compliment the hybridisation programmes for packaging that are currently in progress at the CSA Catapult. The equipment shall be flexible and be able to process several metals compatible with the advanced packaging of electronic devices. These include copper, nickel alloys, and stainless steels. Other materials may be of interest as well due the nature of any developments. The manufacturer/authorised vendor shall install the system at CSA Catapults Innovation Centre, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support System Outline The system architecture is expected to be a standalone machine and is expected to have additional post processing equipment to support the component build. This will include equipment for cleaning, curing and sintering of the parts to produce this final component. It may also include equipment to handle, store and sort the raw material. The system should have capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes. A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation and training. The estimated value of the contract is £450,000 to £550,000 including all options and extensions. The system will be ordered in June and installed in October 2021. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-049 in the subject field.

Scope The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a tensiometer for tensile, shear, bending, compression, flexure, rupture and creep analysis. We are further interested in properties at temperature between -40 and 300 °C. The machine would provide build evaluation and validation for metal, ceramic and multi material 3D printing, where we look to achieve material properties similar to traditionally prepared ceramics and metals. The tool shall be capable of taking test tensile and flexural specimen for ceramics, and tensile, flexural, shear and compression samples for polymers and metals. We would also anticipate a need for testing irregularly shaped parts e.g. lattice, cantilevered fins or hollow components. Tests should be performed to the relevant ISO / ASTM standard. The system will be installed at the CSA Catapult Innovation Centre, within the Advanced Packaging Prototyping and DER Laboratory which will be equipped with access to all power, gas and services for full installation and operation. System Outline The system architecture is expected to be a standalone testing platform, accompanied by a computer, any gas management system required for functionality. The system shall incorporate all software elements required to control, capture and analyse data generated by the system. The expectation is that the technology will be used for testing metal and ceramics( typically including, silicon nitride, copper, aluminium) and combination of materials such as copper and ceramics. Any proposed machine should be able to meet relevant test standards e.g. ISO or ASTM, some of which have been indicated adjacent to the requirements. Delivery after successful tender is expected in late 2021 for all elements. A total system solution is required, which covers the workstation, interchangeable accessories, power supplies, user software, a 'quick start' kit, installation (where CSAC provide necessary power and gas connections within 2 m of the machines) and training. We require installation, commissioning, calibration, training and continuous support including maintenance for the selected system. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-052 in the subject field.

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes. As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications. The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 40:1 with high-quality edge finish and minimum taper angle (preferably 90-degree cut). The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming. System Outline The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated. A system solution is required that is flexible and upgradable in the future. Additional information: The estimated value of the contract is £250,000 to £350,000 including goods to meet the requirements, user software, installation, training, options and extensions. The system will must be invoiced before the end of December 2021 delivered in January 2022. To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-053 in the subject field.

The Compound Semiconductor Applications Catapult is new Not for Profit organisation headquartered in South Wales and focused on helping industry exploit advances in CS technologies to make new technologies in a range of sectors a reality.  We are here to help the UK economy grow, and we work across the UK with a range of industry sectors from automotive to medical, and from digital communications to aerospace. The Compound Semiconductor Applications Catapult currently has circa 30 Projects in delivery phase with a strong pipeline and is looking to implement a PPM system to manage their Project Management and Resource Management functions. We have a mix of Projects: • Commercial projects - usually short term and initial costing is based on a quote; • Collaborative R&D Projects - normally 2+ years in length and involve a mix of partners where initial costing will have been submitted in a Bid and grant monies awarded; and • Internal Evaluation Model projects - these don't have Project budgets, but do track costs. We require a system that will holistically provide Management Information from the high level initial project plan (bid/ quote stage) through to Project Delivery, showing resource capacity and utilisation, project progress, Status reports and RAG status, Budgetary baselines and forecasts with variances against actuals. There will be approximately 80 licensed users, including 65-70 Resources using the system to enter time against Project work assignments, the rest a mix of Project Managers/ Resource Managers and Executives requiring access to report suite. Integration is required with Microsoft Dynamics 365 CRM and potentially with 3rd party HR, Expense and PO approval systems. The system should be accessed via the cloud and/or mobile and tablet Apps. Single sign-on would be a benefit. Implementation after successful tender is expected in late 2021. A total system solution is required, with training and nominated after sales support contact. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-051 in the subject field.

The CSA Catapult helps UK companies, particularly SME's, to grow by exploiting advancements in compound semiconductor technologies which translate into opportunities for: • Power electronics e.g. smart grid, electric vehicle powertrain • RF/microwave e.g. RADAR, Wi-Fi and 5G • Photonics e.g. security scanning, health diagnostics and high speed communications. The CSA Catapult is seeking to appoint a suitably capable and experienced Supplier to provide external financial auditing and related services, to include (but not limited to): • Audit of Statutory accounts • General Accountancy Advice • Corporation Tax computation service Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with CON-2021-054 in the subject field.

The system should comprise of a 2U rack mounted system with multi-channel PSU, HD displays, system software, Digital multi-meter, calibration standards and documentation. The system will be capable of performing standalone, synchronous pulsing of the gate and drains of FETs. The system shall be capable of performing DC-IV measurement and S-parameters in both CW and pulsed mode. This should be a turn-key solution with a central user interface, and modularity for future upgrade potential. The system is required by the end of March 2022. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-056 in the subject field.

Scope The Delta tuners form a part of a new load (and source) pull system to enable the RF laboratory to carry out load pull measurements to 67GHz. This will allow for measurement of the input and output large signal impedances of the DUT, input delivered power and real added efficiency, and in-situ absolute tuner Gamma removing the reliance on mechanical tuner repeatability. This test and measurement equipment will be used for R&D during the Catapult's collaborative and internal projects whilst also providing potential commercial opportunities in compliance and pre-qualification testing. The equipment will be located in the RF Laboratory of the CSA Catapult as the main objective for the acquisition is to use the equipment to characterise high speed RF devices (bare die semiconductor) and built-up RF modules (amplifiers). System Outline The system shall comprise of 2 RF tuner heads (load and source) and a 4-axis bed on which they are supported along with other probes which will connect the DC voltages to the device under test. The equipment shall interface to the 67 GHz Keysight PNA-X that is currently located in the RF lab along with a companion PC running windows O.S. which contains the software that is supplied to run the tests. Refurbished offerings will be considered provided warranties are included. The system is required by the end of March 2022. Additional information: To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-057 in the subject field.

See contract notice FTS - 2022/S 000-028839 Our ref - CON-2022-059. No contract awarded.