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| Source: | Find a Tender Service (FTS) |
| Buyer: | University of Strathclyde |
| Main Category: | Goods |
| Procurement Method: | Open procedure |
| Tender Status: | Complete |
| Estimated Value (ex. VAT): | £1,000,000 |
| Release Date: | 19 June 2024 |
| Application Deadline: |
| 22 July 2024 |
| Procurement ID (OCID): | ocds-h6vhtk-047100 |
| Notice Reference: | 018851-2024 |
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.
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Pipeline status
Not addedContract imported automatically · AI writes the response
Application Deadline
22 July 2024
Closed
Estimated Value
£1,000,000
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